Mijing IPH-22 0.12mm CPU Comprehensive BGA Reballing Stencil for iPhone 16 Series, Mijing IPH-22

1. High Precision BGA Reballing Stencil: Mijing IPH-21 is specifically designed for iPhone 16 series, ensuring precise alignment and perfect soldering for every solder point.
2. Longer lasting: The surface is specially treated to improve wear resistance, extending the life of the stencil.
3. Made of highly heat-resistant and non-deformable materials, ensuring long-term stability and reliability during use.
4. User-friendly design: The stencil design is intuitive, suitable for all types of technicians, allowing use without professional training.
5. Improved welding quality: With precise hole design, effectively improve welding quality, preventing short circuits and cold joints.
6. High temperature resistance: Able to withstand high temperatures during the welding process without deformation.