Mijing A14 3D BGA Stencil IC Soldering Reball Tin Plant Net for iPhone 12 Series, Mijing A14

1. This 3D stencil is easy to use no matter you are new or experienced.
2. High success rate of tin soldering, solder balls can be formed once after you are skilled.
3. This 3D planting stencil is thicker than ordinary stencils in the market. The trend of no deformation makes its use of life.
4. The square hole design makes it easier to take out the formed solder balls.
5. Professional and practical, compact and portable.