Qianli QS04 Bumblebee Stencil BGA Reballing Planting Tin Plate for iPh

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Qianli QS04 Bumblebee Stencil BGA Reballing Planting Tin Plate for iPhone

€4,23

Options

1. Square hole design, precise position
2. High temperature resistance, fast and convenient
3. Excellent IC or BGA replacement rework and reassembly
4. Made of high quality steel, strong and durable, ensures long life
5. This product is small and durable
6. Compatible for iPhone X / 8/8 Plus

Size:

package weight

Weight of each package

0.02kgs / 0.05lb

One size fits all product

15cm * 9cm * 1cm / 5.91inch * 3.54inch * 0.39inch

Quantity of a box

600

Weight of a box

13.00kgs / 28.66lb

Dimensions of a box

47cm * 38cm * 27cm / 18.5inch * 14.96inch * 10.63inch

Goods counter

20GP: 552 Box * 600 Piece = 331200 Piece
40HQ: 1283 Box * 600 Piece = 769800 Piece

Qianli QS04 Bumblebee Stencil BGA Reballing Planting Tin Plate for iPhone

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Qianli QS04 Bumblebee Stencil BGA Reballing Planting Tin Plate for iPhone

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