Prodotto selezionato
Qianli 4-in-1 Magnetic Intermediate Layer BGA Reballing Platform for iPhone 16 Series, Qianli for iPhone 16 Series
€39,38
Disponibile
1. 4 in 1 midframe reballing platform, precise positioning for high-precision motherboard, strong magnetic pressure without bulging, for iPhone 16/16 Plus/16 Pro/16 Pro Max 2. To show the beauty of design in a compact form,...
Pagamenti sicuri
Acquista con metodi di pagamento protetti.
Spedizione tracciata
Segui il tuo ordine dopo l’acquisto.
Assistenza clienti
Supporto disponibile per informazioni sul prodotto.
Descrizione prodotto
1. 4 in 1 midframe reballing platform, precise positioning for high-precision motherboard, strong magnetic pressure without bulging, for iPhone 16/16 Plus/16 Pro/16 Pro Max
2. To show the beauty of design in a compact form, worry-free motherboard reballing is compact and easy, saving space
3. Sliding dislocation design of magnet, intelligent application of sliding dislocation design, easy to take
4. High precision CNC integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning without offset, and the encounter with high temperature magnetism will not weaken
6. Strong high temperature magnetic pressure prevents the stencils from swelling due to high temperature
7. Avoid the SIM card base being tinned while the motherboard is tinned
8. Imported selection of high-quality steel material, produced according to QianLi black stencil standard, wear resistance, ultra-high toughness to support reballing
9. Beveled mesh square, prevents the tin balls from getting stuck in the mesh
10. Package includes:
1 x Reballing Platform
2 x stencil
2. To show the beauty of design in a compact form, worry-free motherboard reballing is compact and easy, saving space
3. Sliding dislocation design of magnet, intelligent application of sliding dislocation design, easy to take
4. High precision CNC integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning without offset, and the encounter with high temperature magnetism will not weaken
6. Strong high temperature magnetic pressure prevents the stencils from swelling due to high temperature
7. Avoid the SIM card base being tinned while the motherboard is tinned
8. Imported selection of high-quality steel material, produced according to QianLi black stencil standard, wear resistance, ultra-high toughness to support reballing
9. Beveled mesh square, prevents the tin balls from getting stuck in the mesh
10. Package includes:
1 x Reballing Platform
2 x stencil
Size:
| General |
|
| package weight |
|