Qianli Magnetic Intermediate Layer BGA Reballing Platform, For iPhone 15 Series, For iPhone 14 Series

1. Middle frame reballing platform, precise positioning for high precision motherboard, strong magnetic pressure without bulging
2. To show the beauty of design in a compact form, worry-free motherboard reballing is compact and easy, saving space
3. Magnet sliding dislocation design, intelligent application of sliding dislocation design, easy to take
4. High precision CNC integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning without offset, and meeting high temperature magnetism will not weaken
6. Strong high temperature magnetic pressure prevents the molds from swelling due to high temperature