2UUL Manual Finishing Blades for Phone Screen Peeling/Removing IC, S, E, X, Y

1. Double-sided uniform finishing, patented utility model technology
2. The blade goes from thin to thick and the force is more uniform
3. It is suitable for removing glue from the screen and removing CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc.
4. Updated to a more practical folded blade design, by folding the blade, the loss on the motherboard, chip, screen, etc. is realized and reduced, thus improving the yield
5. Nano-coating is anti-rust, the blade body is flexible, thin and elastic, the thickness of the blade tip is 0.06mm, and the thickness of the blade tail is about 0.3mm