Prodotto selezionato
Mobile Phone Motherboard Intelligent Repair Heating Platform Kit Support IP7G-16PM/Android Universal, SUNSHINE SS-T12B 13 In 1, SUNSHINE SS-T12B 9 In 1
€127,88
Disponibile
1. Operating voltage: AC220V/50Hz (AC110V can be customized) 2. Temperature range: 80-250°C 3. Net weight: 13 in 1 about 1000g, 9 in 1 about 915g 4. Size: host about 13.5 x 13 x 2.8cm, heating...
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Descrizione prodotto
1. Operating voltage: AC220V/50Hz (AC110V can be customized)
2. Temperature range: 80-250°C
3. Net weight: 13 in 1 about 1000g, 9 in 1 about 915g
4. Size: host about 13.5 x 13 x 2.8cm, heating area about 5.2 x 9.5cm
5. Packing list: 13 in 1: Host x 1/Module x 12/Instruction manual x 1/Power cord x 1, 9 in 1: Host x 1/Module x 8/Instruction manual x 1/Power cord x 1
Functional features:
1. Large heating area, good compatibility, support a variety of motherboard components desoldering operation, more convenient and fast
2. Modular design, a variety of module combinations, basic universal module, scalability, easy to expand the new module
3. Intelligent temperature control, customized according to different melting point debugging temperature, with rapid heating, long life, temperature uniformity
4. 360 degree rotating snap guide design, suitable for different forms of motherboard precision clamping, improve maintenance efficiency
5. Accurate positioning module, set with positioning columns, can be accurately separated and fit the motherboard, easy to pick up, heat dissipation and anti-slip
6. No air gun and no soldering iron, support IP7G-16PM/Android series of various sizes of mobile phone motherboard layering/tinning/laminating/desoldering
7. Real machine test to ensure accuracy, suitable for IP16/16Plus/16Pro/16Pro Max, to meet your maintenance needs
2. Temperature range: 80-250°C
3. Net weight: 13 in 1 about 1000g, 9 in 1 about 915g
4. Size: host about 13.5 x 13 x 2.8cm, heating area about 5.2 x 9.5cm
5. Packing list: 13 in 1: Host x 1/Module x 12/Instruction manual x 1/Power cord x 1, 9 in 1: Host x 1/Module x 8/Instruction manual x 1/Power cord x 1
Functional features:
1. Large heating area, good compatibility, support a variety of motherboard components desoldering operation, more convenient and fast
2. Modular design, a variety of module combinations, basic universal module, scalability, easy to expand the new module
3. Intelligent temperature control, customized according to different melting point debugging temperature, with rapid heating, long life, temperature uniformity
4. 360 degree rotating snap guide design, suitable for different forms of motherboard precision clamping, improve maintenance efficiency
5. Accurate positioning module, set with positioning columns, can be accurately separated and fit the motherboard, easy to pick up, heat dissipation and anti-slip
6. No air gun and no soldering iron, support IP7G-16PM/Android series of various sizes of mobile phone motherboard layering/tinning/laminating/desoldering
7. Real machine test to ensure accuracy, suitable for IP16/16Plus/16Pro/16Pro Max, to meet your maintenance needs
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