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- Luowei LW-AP02 carbon fiber high temperature triaxial motherboard device, LW-AP02 Luowei LW-AP02 carbon fiber high temperature triaxial motherboard device, LW-AP02
% €-31,51


















Luowei LW-AP02 carbon fiber high temperature triaxial motherboard device, LW-AP02
Product SKU: EDA0067329
Available:
Only 999999 items in stock
999999 items in stock
In stock
Pre-order
Out of stock
€31,51
- Description
1. Corrosion-resistant, high temperature resistant carbon fiber plate, with a flat surface that is easy to clean
2. With high stability and firm grip, it features excellent vibration resistance, with a secure grip that eliminates worries of slipping or moving
3. Auxiliary slider design with perfect coordination when used together with the guides, can block 99% of the motherboards
4. Highly compatible triaxial helical design, not only provides a variety of locking combinations, but also has extremely high applicability
5. Unique hollow design, easy to clean, not only helps heat dissipation, but also facilitates daily cleaning and maintenance
6. Precise locking, non-damaging locking and carefully designed grooves ensure no damage to the motherboard and no impact on its performance
7. The size of the grooves are meticulously designed to be compatible with all single-layer motherboards, ensuring perfect locking of the single-layer motherboard
8. Unique groove design, specially designed for dual-layer motherboards, ensures no damage to dual-layer motherboards and prevents chips from jamming on the edge of the motherboard
9. Safe clamping distance and firm grip, compatible with 99% of mobile phone motherboards, also support Android and irregular-shaped motherboards
2. With high stability and firm grip, it features excellent vibration resistance, with a secure grip that eliminates worries of slipping or moving
3. Auxiliary slider design with perfect coordination when used together with the guides, can block 99% of the motherboards
4. Highly compatible triaxial helical design, not only provides a variety of locking combinations, but also has extremely high applicability
5. Unique hollow design, easy to clean, not only helps heat dissipation, but also facilitates daily cleaning and maintenance
6. Precise locking, non-damaging locking and carefully designed grooves ensure no damage to the motherboard and no impact on its performance
7. The size of the grooves are meticulously designed to be compatible with all single-layer motherboards, ensuring perfect locking of the single-layer motherboard
8. Unique groove design, specially designed for dual-layer motherboards, ensures no damage to dual-layer motherboards and prevents chips from jamming on the edge of the motherboard
9. Safe clamping distance and firm grip, compatible with 99% of mobile phone motherboards, also support Android and irregular-shaped motherboards
Size:
package weight |
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Caratteristiche