RELIFE RL-101H 2 In 1 Motherboard Intermediate Layer Blade Mobile Phone CPU Removal Tool

1. The blade is forged from high-tenacity alloy steel, refined by high-temperature quenching up to 8 times, with a highly efficient balance of hardness and toughness
2. The blade body is tempered, the edge is ultra-thin, and the blade edge design structure is more suitable for the use requirements
3. Full toughness, zero damage to the motherboard chip, so that the mobile phone chip gets better protection
4. Beveled layered blade: 30 degree beveled design, hard thin blade, layered maintenance efficiency
5. Right angle layered blade: thin edge, hard body, special technology forged several times, uniform spring force
6. Weight: about 1g
7. Size: about 4.5 x 1.1cm