Phone Motherboard IC Repair 2UUL BH09 THE ONE JIG (Indian Version)

1. General mobile phone maintenance device, fixed rotary design, no bounce, firmly fixed
2. Prevents clamps from moving during use, special anti-slip pad
3. Let the hot air be exhausted more efficiently and add a heat sink to the bottom of the clamp
4. The rotating shaft locks the motherboard or IC more efficiently, fixed well without bounce
5. The devices also support IC type devices fixed for removing the back glue, the clamp is designed to withstand the force of the IC beam, which can support the IC hollow parts well and avoid the IC breaking when removing the black glue
6. The device can be adjusted to different distances from the high, medium and low levels. You need to loosen the two screws at the bottom, move the fixing plate to the appropriate gear position, and then tighten the bottom screws to lock it
7. Protect the upper and lower layers of the dual-layer motherboard during maintenance
8. Suitable for mobile phone motherboards of various sizes and shapes
9. Suitable for fixing when cleaning large chips such as CPU and NAND