Mechanical Reflow Soldering Heating Platform, US Plug, Reflow (EU Plug), Reflow (US Plug)

1. Reflow soldering heating platform, 5 professional selection modes, 3 common mode working modes
2. Especially for the original mobile phone motherboard welding, curve heating, intelligent and safe desoldering and reflow
3. The traditional single heating element is banished, and the new MCH double ceramic heating element is adopted, which has faster heating, more uniform temperature and stable performance
4. 5 application scene modes of degumming, layering, lamination, tin seeding and welding can be switched arbitrarily
5. 3 commonly used memory temperatures, automatic recording of the current temperature (save when the power is off) and manual recording of the current temperature mode
6. Turbofan blades for heat dissipation, built-in powerful wind cooling system, the fan adjusts speed according to temperature to dissipate heat
7. Monitor temperature changes and realize reflow soldering temperature curve data monitoring
8. Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view
9. Scope of application: for iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max