BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Tabl

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BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table for iPhone A11, BaKu For IPhone A11

€44,35

Options

1. Fast, stable and precise positioning
2. High temperature resistant material, not easy to deform, no swelling, no virtual welding.
3. Assist professionals to perform BGA tin planting conveniently and safely.
4. For iPhone A11
5. The force is more durable and not deformed
6. Dimensions: 85 x 85 x 15mm
7. Weight: 376 grams

Size:

General

Compatible with

Apple: iPhone 11

package weight

Weight of each package

0.40kgs / 0.89lb

One size fits all product

5cm * 3cm * 4cm / 1.97inch * 1.18inch * 1.57inch

Quantity of a box

Weight of a box

30.00kgs / 66.14lb

Dimensions of a box

20cm * 12cm * 16cm / 7.87inch * 4.72inch * 6.3inch

Goods counter

20GP: 6944 Box * 74 Piece = 513856 Piece
40HQ: 16121 Box * 74 Piece = 1192954 Piece

BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table for iPhone A11, BaKu For IPhone A11

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BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table for iPhone A11, BaKu For IPhone A11

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