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Oltre 1 milione di prodotti
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i2C T18 LCD Display PCB Motherboard Layered Desoldering Station for iPhone X-15 Pro Max with Glue Removal Module, For iPhone X-15 Pro Max Module+Glue Removal Module
€70,07
This product will be available for sale in 2 weeks, but you can pre-order now to receive 10% discount!
2. Model: T18
3. Minimum temperature: 180 degrees Celsius
4. Display: LED digital display
5. Maximum temperature: 245 degrees Celsius
6. Body size: 13.4 x 11.6 x 1.7 cm
7. Scope of use: separation and connection of the motherboard
8. T18 PCB Motherboard Desoldering Station, Magnetic Modular Design, Constant Temperature Desoldering and Explosion-Proof
9. HD LCD display, 2 gears of temperature adjustment, iPhone X to 15Pro Max motherboard separation, CPU chip glue removal and other functions
10. Aviation aluminum material, CNC precision machining, high temperature resistance and oxidation resistance
11. Rapid heating, combined with PTC ceramic heating pieces, can quickly heat up to 180 degrees Celsius in 60 seconds
12. Strong magnetic automatic adsorption module, replace the module as you like, simple and more convenient
13. Wear the chip and switch to 245 degrees Celsius, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98% of the chips, and can meet the needs of 98% of the ICe glue removal desoldering on the market.
14. Only one host can support multiple modules, support double-layer motherboard layering, adaptation and repair, and can also be applied to the repair of various precision electronic and digital products
| General |
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i2C T18 LCD Display PCB Motherboard Layered Desoldering Station for iPhone X-15 Pro Max with Glue Removal Module, For iPhone X-15 Pro Max Module+Glue Removal Module
€70,07
This product will be available for sale in 2 weeks, but you can pre-order now to receive 10% discount!
Share:
€70,07
€70,07
€70,07
- For iPhone X-15 Pro Max Module+Glue Removal Module
2. Model: T18
3. Minimum temperature: 180 degrees Celsius
4. Display: LED digital display
5. Maximum temperature: 245 degrees Celsius
6. Body size: 13.4 x 11.6 x 1.7 cm
7. Scope of use: separation and connection of the motherboard
8. T18 PCB Motherboard Desoldering Station, Magnetic Modular Design, Constant Temperature Desoldering and Explosion-Proof
9. HD LCD display, 2 gears of temperature adjustment, iPhone X to 15Pro Max motherboard separation, CPU chip glue removal and other functions
10. Aviation aluminum material, CNC precision machining, high temperature resistance and oxidation resistance
11. Rapid heating, combined with PTC ceramic heating pieces, can quickly heat up to 180 degrees Celsius in 60 seconds
12. Strong magnetic automatic adsorption module, replace the module as you like, simple and more convenient
13. Wear the chip and switch to 245 degrees Celsius, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98% of the chips, and can meet the needs of 98% of the ICe glue removal desoldering on the market.
14. Only one host can support multiple modules, support double-layer motherboard layering, adaptation and repair, and can also be applied to the repair of various precision electronic and digital products
| General |
|
| package weight |
|
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