Oltre 1 milione di prodotti
Catalogo ampio e sempre aggiornato
Prezzi competitivi ogni giorno
Pagamenti sicuri e ordini tracciabili
Oltre 1 milione di prodotti
Catalogo ampio e sempre aggiornato
Prezzi competitivi ogni giorno
Pagamenti sicuri e ordini tracciabili
Oltre 1 milione di prodotti
Catalogo ampio e sempre aggiornato
Prezzi competitivi ogni giorno
Pagamenti sicuri e ordini tracciabili
Oltre 1 milione di prodotti
Catalogo ampio e sempre aggiornato
Prezzi competitivi ogni giorno
Pagamenti sicuri e ordini tracciabili
Oltre 1 milione di prodotti
Catalogo ampio e sempre aggiornato
Prezzi competitivi ogni giorno
Pagamenti sicuri e ordini tracciabili
Oltre 1 milione di prodotti
Catalogo ampio e sempre aggiornato
Prezzi competitivi ogni giorno
Pagamenti sicuri e ordini tracciabili
Welcome to 16e88.com
Your cart
Qianli 4-in-1 Magnetic Intermediate Layer BGA Reballing Platform for iPhone 16 Series, Qianli for iPhone 16 Series
€39,83
This product will be available for sale in 2 weeks, but you can pre-order now to receive 10% discount!
2. To show the beauty of design in a compact form, worry-free motherboard reballing is compact and easy, saving space
3. Sliding dislocation design of magnet, intelligent application of sliding dislocation design, easy to take
4. High precision CNC integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning without offset, and the encounter with high temperature magnetism will not weaken
6. Strong high temperature magnetic pressure prevents the stencils from swelling due to high temperature
7. Avoid the SIM card base being tinned while the motherboard is tinned
8. Imported selection of high-quality steel material, produced according to QianLi black stencil standard, wear resistance, ultra-high toughness to support reballing
9. Beveled mesh square, prevents the tin balls from getting stuck in the mesh
10. Package includes:
1 x Reballing Platform
2 x stencil
| General |
|
| package weight |
|
Choose your Location
-
websrl
Corso Europa snc, 95014 - Giarre CT
📞 +39 095 938900
🕐 LUN-VEN: 8.30-13.00 e 14.30-18.00
🔒 SAB-DOM: Chiuso
Confronto Prodotti
In cosa si differenziano
|
__ __ |
|
|---|---|
| Descrizione |
Descrizione - __ |
| Valutazione |
Valutazione - __ |
| Colore |
Colore - __ |
|
|
Compare products ( / )
Qianli 4-in-1 Magnetic Intermediate Layer BGA Reballing Platform for iPhone 16 Series, Qianli for iPhone 16 Series
€39,83
This product will be available for sale in 2 weeks, but you can pre-order now to receive 10% discount!
Share:
€39,83
€39,83
€39,83
- Qianli for iPhone 16 Series
2. To show the beauty of design in a compact form, worry-free motherboard reballing is compact and easy, saving space
3. Sliding dislocation design of magnet, intelligent application of sliding dislocation design, easy to take
4. High precision CNC integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning without offset, and the encounter with high temperature magnetism will not weaken
6. Strong high temperature magnetic pressure prevents the stencils from swelling due to high temperature
7. Avoid the SIM card base being tinned while the motherboard is tinned
8. Imported selection of high-quality steel material, produced according to QianLi black stencil standard, wear resistance, ultra-high toughness to support reballing
9. Beveled mesh square, prevents the tin balls from getting stuck in the mesh
10. Package includes:
1 x Reballing Platform
2 x stencil
| General |
|
| package weight |
|
- Choosing a selection results in a full page refresh.
- Opens in a new window.