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Oltre 1 milione di prodotti
Catalogo ampio e sempre aggiornato
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Pagamenti sicuri e ordini tracciabili
Oltre 1 milione di prodotti
Catalogo ampio e sempre aggiornato
Prezzi competitivi ogni giorno
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Oltre 1 milione di prodotti
Catalogo ampio e sempre aggiornato
Prezzi competitivi ogni giorno
Pagamenti sicuri e ordini tracciabili
Oltre 1 milione di prodotti
Catalogo ampio e sempre aggiornato
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Pagamenti sicuri e ordini tracciabili
2UUL THE ONE JIP Tempered Insulating Glass Appliance
€25,96
This product will be available for sale in 2 weeks, but you can pre-order now to receive 10% discount!
2. Prevent the clamps from moving during use, special anti-slip pad
3. Let the hot air be discharged more efficiently, add the heat sink at the bottom of the clamp
4. The rotating shaft locks the motherboard or IC more efficiently, fixed well without bounce
5. The devices also support IC type devices fixed for back glue removal, the clamp is designed to withstand the force of IC beam, which can support the IC blank parts well and avoid IC breakage when removing black glue
6. The device can be adjusted to different distances from the high, medium and low levels. You need to loosen the two screws at the bottom, move the fixing plate to the appropriate gear position, and then tighten the bottom screws to lock it
7. Protect the upper and lower layers of the dual-layer motherboard during maintenance
8. Suitable for mobile phone motherboards of various sizes and shapes
9. Suitable for fixing when cleaning large chips such as CPU and NAND
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2UUL THE ONE JIP Tempered Insulating Glass Appliance
€25,96
This product will be available for sale in 2 weeks, but you can pre-order now to receive 10% discount!
Share:
€25,96
€25,96
€25,96
2. Prevent the clamps from moving during use, special anti-slip pad
3. Let the hot air be discharged more efficiently, add the heat sink at the bottom of the clamp
4. The rotating shaft locks the motherboard or IC more efficiently, fixed well without bounce
5. The devices also support IC type devices fixed for back glue removal, the clamp is designed to withstand the force of IC beam, which can support the IC blank parts well and avoid IC breakage when removing black glue
6. The device can be adjusted to different distances from the high, medium and low levels. You need to loosen the two screws at the bottom, move the fixing plate to the appropriate gear position, and then tighten the bottom screws to lock it
7. Protect the upper and lower layers of the dual-layer motherboard during maintenance
8. Suitable for mobile phone motherboards of various sizes and shapes
9. Suitable for fixing when cleaning large chips such as CPU and NAND
| package weight |
|
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